KAEPPELER, Ulrike; SCHNELLER, Klaus; WALLBURG, Florian; ENGISCH, Lutz; SCHÖNFELDER, Stephan. Analysis of the Compression Behavior of Different Cardboard Materials During Embossing. Open Conference Proceedings, [S. l.], v. 2, p. 129–135, 2022. DOI: 10.52825/ocp.v2i.132. Disponível em: https://www.tib-op.org/ojs/index.php/ocp/article/view/132. Acesso em: 19 apr. 2024.