BRINKMANN, Malte; SCHULTE-HUXEL, Henning; HOLLEMANN, Christina; MIN, Byungsul; JUNGE, Sebastian; BRENDEL, Rolf. Ultrasonic Tinning of Al Pads for Silver- and Lead-Free Cell Interconnection. SiliconPV Conference Proceedings, [S. l.], v. 3, 2026. DOI: 10.52825/siliconpv.v3i.2678. Disponível em: https://www.tib-op.org/ojs/index.php/siliconpv/article/view/2678. Acesso em: 14 mar. 2026.